Research Nester’s recent market research analysis on “High-Speed Interconnects Market: Global Demand Analysis & Opportunity Outlook 2035” delivers a detailed competitors analysis and a detailed overview of the global high-speed interconnects market in terms of market segmentation by type, application, and by region.

Rising IoT-Connected Devices to Boost the Growth of the Global High-Speed Interconnects Market

The global market for high-speed interconnects is estimated to grow on account of rising IoT-connected devices. The demand for efficient and dependable interconnection is growing as the Internet of Things is being adopted more widely. But for IoT to fully realize its potential, a strong connectivity ecosystem must be built, one that accepts various wireless protocols and fast 5G and WiFi 6+ networks while utilizing their unique benefits for specific IoT applications. As a result, there is an increasing need for high-speed interconnects.

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Furthermore, to fulfill the demands of contemporary data centers, which are raising the need for higher signal speeds, larger bandwidth, and higher density interconnections, high-speed connector and cable assembly providers are continuously developing new technologies. Consequently, it is expected that this element would increase market demand.

Some of the major growth factors and challenges that are associated with the growth of the global high-speed interconnects market are:

Growth Drivers:

· Rise in People Working from Home

· Growth in Video Streaming

Challenges:

High energy consumption goes hand in hand with speed. Additionally, the addition of cloud services to the already widely connected internet has caused a record-breaking rise in the amount of processing and storage that data centers are required to handle. This leads to a greater consumption of power. Since of this, many businesses are concentrating on producing low-speed interconnects that offer excellent efficiency. Therefore, it is anticipated that this factor would restrict the uptake of high-speed interconnects, impeding the increase in market revenue.

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By type, the market for high-speed interconnects is segmented into direct attach cables and active optical cables. Out of these segments, the active optical cables segment is expected to garner the highest revenue by the end of 2035. However, the direct attach cables segment is also anticipated to grow. Direct connect cables are excellent for short-distance cabling in data centers since they have lower transmission distances than active optical cables. Additionally, the direct connect cable has an internal copper core and is composed of that material. It is energy-efficient and environmentally friendly to use copper cable, a natural radiator with good heat dissipation properties.

By region, the Europe market for high-speed interconnects is poised to grow by the projected period. The market growth is anticipated to be supported by the expanding deployment of data centers. Electronic component producers are widely spread throughout the UK and France, while a substantial portion of the equipment, including communication equipment, is manufactured in Russia. Hence, this factor is also estimated to boost the market growth in this region. Furthermore, there has a growing preference for electric vehicles in this region owing to growing environmental regulations. Hence, this factor could also influence the market since these modern electric vehicles consist of advanced driver assistance systems and vehicle-to-vehicle communication systems, which require high-speed interconnects.

This report also provides the existing competitive scenario of some of the key players of the global high-speed interconnects market which includes company profiling of Molex, LLC, Nexans, Leoni Group, Samtec Solutions Private Limited, CBO GmbH, Cisco Systems, Inc., Huawei Technologies Co, Ltd., Intel Corporation, The Siemon Company, Broadcom, Inc., and others.